copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 1 /5 sw 6 n 90 features high ruggedness r ds( on ) (max 2.3 ? )@v gs =10v gate charge (typical 40 nc) improved dv/dt capability 100% avalanche tested general description this power mosfet is produced with advanced vdmos technology of samwin. this technology enable power mosfet to have better characteristics, such as fast switching time, low on resistance, low gate charge and especially excellent avalanche characteristics. it is mainly suitable for half bridge or full bridge resonant topology like a electronic ballast, and also low power switching mode power appliances. n - channel to - 262 mosfet absolute maximum ratings symbol parameter value unit v dss drain to source voltage 900 v i d continuous drain current (@t c =25 o c) 6.0* a continuous drain current (@t c =100 o c) 3.78* a i dm drain current pulsed (note 1) 24 a v gs gate to source voltage 30 v e as single pulsed avalanche energy (note 2) 550 mj e ar repetitive avalanche energy (note 1) 150 mj dv/dt peak diode recovery dv/dt (note 3) 5 v/ns p d total power dissipation (@t c =25 o c) 231 w derating factor above 25 o c 1.85 w/ o c t stg , t j operating junction temperature & storage temperature - 55 ~ + 150 o c t l maximum lead temperature for soldering purpose, 1/8 from case for 5 seconds. 300 o c thermal characteristics symbol parameter value unit r thjc thermal resistance, junction to case 0.54 o c/w r thcs thermal resistance, case to sink - o c/w r thja thermal resistance, junction to ambient 65 o c /w bv dss : 900v i d : 6.0a r ds(on) : 2.3ohm 1 2 3 1 3 1. gate 2. drain 3. source to - 262 2 samwin item sales type marking package packaging 1 sw u 6n90 SW6N90 to - 262 tube order codes
copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 2 /5 electrical characteristic ( t c = 25 o c unless otherwise specified ) symbol parameter test conditions min. typ. max. unit off characteristics bv dss drain to source breakdown voltage v gs =0v, i d =250ua 900 v bv dss / t j breakdown voltage temperature coefficient i d =250ua, referenced to 25 o c 0.91 v/ o c i dss drain to source leakage current v ds =900v, v gs =0v 1 ua v ds =720v, t c =125 o c 50 ua i gss gate to source leakage current, forward v gs =30v, v ds =0v 100 na gate to source leakage current, reverse v gs = - 30v, v ds =0v - 100 na on characteristics v gs(th) gate threshold voltage v ds =v gs , i d =250ua 3.0 5.0 v r ds(on) drain to source on state resistance v gs =10v, i d = 3a 1.8 2.3 ? g fs forward transconductance v ds = 40 v, i d = 3 a 6 s dynamic characteristics c iss input capacitance v gs =0v, v ds =25v, f=1mhz 1400 pf c oss output capacitance 120 c rss reverse transfer capacitance 35 t d(on) turn on delay time v ds =450v, i d =6a, r g =25 ? (note 4 5) 23 50 ns tr rising time 26 60 t d(off) turn off delay time 58 120 t f fall time 24 50 q g total gate charge v ds =7 2 0v, v gs =10v, i d =6a (note 4 5) 40 90 nc q gs gate - source charge 8 q gd gate - drain charge 19 source to drain diode ratings characteristics symbol parameter test conditions min. typ. max. unit i s continuous source current integral reverse p - n junction diode in the mosfet 6.0 a i sm pulsed source current 24.0 a v sd diode forward voltage drop. i s = 6.0 a, v gs =0v 1.5 v t rr reverse recovery time i s = 6.0 a, v gs =0v, di f / dt =100a/us 436 ns q rr reverse recovery charge 5.2 uc . notes 1. repeatitive rating : pulse width limited by junction temperature. 2. l = 30mh, i as = 6.0a, v dd = 50v, r g =25 ?, starting t j = 25 o c 3. i sd 6.0a, di/dt = 100a/us, v dd bv dss , staring t j =25 o c 4. pulse test : pulse width 300us, duty cycle 2% 5. essentially independent of operating temperature. sw 6 n 90 samwin
copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 3 /5 fig. 1. on - state characteristics fig. 2. on - resistance variation vs. drain current and gate voltage fig. 3. gate charge characteristics sw 6 n 90 samwin fig. 4. on state current vs. diode forward voltage fig 5. breakdown voltage variation vs. junction temperature fig. 6. on resistance variation vs. junction temperature
copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 4 /5 sw 6 n 90 samwin fig. 7. maximum safe operating area fig. 8. transient thermal response curve v dd dut v ds r l r gs 10v in 10% v ds v in 90% 10% t d(on) t r t on t d(off) t off t f fig. 9. gate charge test circuit & waveform fig. 10. switching time test circuit & waveform v ds same type as dut dut v gs 1.5 ma q g q gs q gd v gs charge nc 10v
copyright@ semipower electronic technology co., ltd. all rights reserved. july. 2013. rev. 3.0 5 /5 fig. 11. unclamped inductive switching test circuit & waveform sw 6 n 90 samwin fig. 12. peak diode recovery dv/dt test circuit & waveform v dd same type as dut v ds l r g 10v gs i s + - v ds dut *. dv/dt controlled by rg *. is controlled by pulse period v gs (driver) i s (dut) v ds (dut) body diode forward voltage drop v f diode recovery dv/dt i rm di/dt 10v diode reverse current v dd
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